Ray Cathcart

Systems And Methods For Optimizing Looping Parameters And Looping Trajectories In The Formation Of Wire Loops

Application

#2019029 Sep 26, 2019

Filed

Jun 13, 2019

Inventor

Ray L. Cathcart (New York, NY) · Cuong Huynh (Radnor, PA) · Deepak Sood (New Britain, PA) · Paul W. Sucro (Hatfield, PA) · Joseph O. DeAngelo (Winters, CA)

Appl. No.

16/439923

Assignee

Ray L. Cathcart (New York, NY) · Cuong Huynh (Radnor, PA) · Deepak Sood (New Britain, PA) · Paul W. Sucro (Hatfield, PA) · Joseph O. DeAngelo (Winters, CA)

International Classification

H01L 23/00, B23K 20/00, H01L 21/66

Abstract

A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Systems And Methods For Optimizing Looping Parameters And Looping Trajectories In The Formation Of Wire Loops

Application

#2017003 Feb 2, 2017

Filed

Oct 11, 2016

Inventor

Ray L. Cathcart (New York, NY) · Cuong Huynh (Radnor, PA) · Deepak Sood (New Britain, PA) · Paul W. Sucro (Hatfield, PA) · Joseph O. DeAngelo (Winters, CA)

Appl. No.

15/290413

Assignee

Ray L. Cathcart (New York, NY) · Cuong Huynh (Radnor, PA) · Deepak Sood (New Britain, PA) · Paul W. Sucro (Hatfield, PA) · Joseph O. DeAngelo (Winters, CA)

International Classification

H01L 23/00, B23K 20/00, H01L 21/66

Abstract

A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Systems And Methods For Optimizing Looping Parameters And Looping Trajectories In The Formation Of Wire Loops

Application

#2012006 Mar 15, 2012

Filed

May 17, 2010

Inventor

Ivy Wei Qin (Lansdale, PA) · Ray L. Cathcart (Elkins Park, PA) · Cuong Huynh (Radnor, PA) · Deepak Sood (New Britain, PA) · Paul W. Sucro (Hatfield, PA) · Joseph O. DeAngelo (Winters, CA)

Appl. No.

13/321017

Assignee

KULICKE AND SOFFA INDUSTRIES, INC. (Fort Washington, PA)

International Classification

G06F 17/00

U.S. Classification

700103, 700108

Abstract

A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).